Hardcopy：2000 USD Electronic：2150 USD Both：2300 USD
CONTENTS
Chapter One IC card and relevant knowledge 1
Section One History, definition and classification of IC card 1
First, history of IC card 1
Second, definition of IC card 2
Third, classification of IC card 4
Section Two Related policy of IC card 13
First, promotion policy of IC card industry 13
Second, preferential policy of IC investment 15
Third, local policy 16
Fourth, new support policies of semiconductor will issue soon 19
Section Three Application pattern of IC card 22
First, application of health insurance card 22
Second, application of telecommunication aspect 24
Third, application of financial aspect 28
Fourth, application of intelligent building 33
Fifth, application of transportation aspect 37
Sixth, application of non-profit organization aspect 38
Section Four New tendency of IC card application 53
First, application subdivision and expedite the emergence of "a card of multi-purpose" 53
Second, the RFID market starts comprehensively 54
Third, prospect of the union of motion payment and IC card is broad 56
Fourth, development trend of IC card in the other application domain 57
Chapter Two RFID technology 60
Section One Overview of RFID 60
First, technology description of RFID 60
Second, distinction of IC card and radio frequency card 62
Third, China's RFID application development 64
Fourth, the strategy that China develop RFID technology 73
Fifth, China's RFID technology development and the priority areas of application 77
Sixth, the macro-environmental construction that China develop RFID technology 82
Section Two Future development trend of RFID 84
First, five tendency of RFID industry in 2008 84
Second, application scale of China’s RFID in 2008 86
Third, feel the pulse of the development of China’s RFID in 2008 89
Fourth, future of RFID in China 93
Fifth, development trend of global RFID 95
Chapter Three Current development state of EMV 98
Section One Development process of EMV migration 98
First, profiles of EMV migration 98
Second, development course of EMV migration 98
Section Two Background and current situation of international EMV migration 99
First, background of international EMV migration 99
Second, mode of EMV migration 100
Third, global progress and impact of EMV migration 101
Fourth, three echelon of global EMV migration in 2007 106
Section Three Problems which exist in China's EMV migration 107
First, reason about EMV migration of banking of our country 107
Second, problems which exist in EMV migration of China's bank card 108
Section Four EMV migration status of China's bank card 110
First, battle of standard in the standard 110
Second, the latest information of China EMV migration in 2008 115
Chapter Four Development of international IC card 118
Section One Development of international IC card 118
First, telecom market 118
Second, bank card market 121
Third, government and health care market 134
Fourth, transport card 135
Section Two International standards of IC card 136
First, standard of non-contact IC card 136
Second, standard of non-contact IC card 137
Section Three Current situation of global IC card market 138
First, current situation of application of global smart card 138
Second, Analysis of world 10 major FRID affairs in 2007 146
Third, development of NFC in 2007 156
Section Four International dynamics of IC card 160
First, Korea Telecom launch non-contact payment services 160
Second, Japanese Seiko HSDPA Communications card select Infineon UMTS RF Transceiver 161
Third, European Air Bus Company chooses ODIN as the cooperative partner 163
Fourth, forecast of global mobile payments market in 2011 164
Chapter Five Industry chain analysis of IC card 165
Section One Supply and demand analysis of IC card chip 165
First, China's IC industry profile in 2007 165
Second, current situation of the development of the domestic and international integrated circuit technology 169
Third, analysis of China's IC industry 176
Fourth, forecasts of China's integrated circuit industry in 2008-2012 190
Section Two Analysis of IC design industry 191
First, development overview of IC design industry in 2007 192
Second, the investigation of design ability and level of China's electronics engineers in 2007 197
Third, SWOT analysis of IC design industry 210
Fourth, IC design industry step into a rational adjustment 229
Fifth, development strategy analysis of IC Design Industry in 2008 233
Section Three IC card packaging and testing industry 238
First, profile analysis of IC card packaging and testing industry in 2007 238
Second, opportunities and problems of packaging and testing industry 251
Third, development overview of IC packaging and testing industry 256
Fourth, development trend of global packaging and testing industry in 2008-2009 261
Section Four Overview analysis of Taiwan IC card industry chain in 2007 268
First, IC design industry 269
Second, IC manufacturing industry 270
Third, IC packaging, testing industry 271
Fourth.prospect in 2008 272
Section Five Overview analysis of the upper reaches enterprise of international IC card 273
First, current situation of Infineon scientific & technological corporation and prospect of 2008 273
Second, Management overview of ATMEL Company 286
Third, management state of Samsung Electronics Co., Ltd. in 2007 297
Fourth, current situation and prospect analysis of STM 302
Fifth, current situation and development of Freescale integrated circuit Co., Ltd. 321
Sixth, current situation of Japan Renesas scientific & technological corporation and strategy analysis of 2008 328
Section Six Main IC card companies of our country 335
First, Zhuhai Actions Semiconductor Design Co., Ltd. 335
Second,Vimicro microelectronics Company 344
Third,CEC Huada Electronic Design Co., Ltd. 346
Fourth,Hangzhou Silan microelectronics Limited Company 348
Fifth, Beijing Tongfang Microelectronics Co.,Ltd. 353
Sixth, Shanghai Fm Microelectronics stock Co.,Ltd. 355
Seventh, Shanghai Belling Limited Company 361
Chapter Six Advantage enterprise's analysis of IC card industry 368
Section One Gemalto Company 368
First, company's profile 368
Second, enterprise trends in 2008 368
Third, management tactics of enterprise in 2008 373
Section Two Oberthur card systems Co.,Ltd. 376
First, company's profile 376
Second, enterprise’s trends 378
Section Three G&D Company 379
First, company's profile 379
Second, enterprise’s trends 381
Section Four Watch Data systematic Co., Ltd. 386
First, company's profile 386
Second, development tactics of enterprise in 2008 387
Third, enterprise's trends 390
Section Five Datang Microelectronics Technology Co.,Ltd. 394
First, company's profile 394
Second, market trend 396
Third, management tactics of enterprise in 2008 397
Section Six ShangHai Huahong Jt smart card systematic limited company 401
First, company's profile 401
Second, products system 402
Third, enterprise trends in 2008 403
Section Seven HengBao Co.,Ltd. 405
First, company's profile 405
Second, production qualification 407
Third, management state of enterprise in 2007 408
Section Eight Aerospace Information Co.,Ltd. 411
First, company's profile 411
Second, development tactics 413
Third, enterprise trends in 2008 415
Chapter Seven Analysis of relevant economic key elements of IC card development 418
Section One Semiconductor industry's development analysis 418
First, operation analysis of semiconductor in 2007 418
Second, analysis of development state and prospect of semiconductor apparatus industry of 2007 421
Third, new opportunity of development of the semiconductor industry 425
Fourth, analysis of development bottleneck and tactics of semiconductor industry 434
Fifth, prediction of the development trend of semiconductor of 2008 444
Section Two Development analysis of retail industry 446
First, overview of Chinese retail business of 2007 446
Second, main enterprise's brief analysis of Chinese retail business 449
Third, future main body perspect of retail business 450
Fourth, prospect analysis of Chinese retail business 455
Section Three Development analysis of information industry 456
First, development situation of information industry of our country in the present stage 456
Second, main characteristic that information industry of our country present 460
Third, development environment that industry's development face 466
Fourth, development trend of future industry 467
Section Four Development analysis of financial industry 470
First, current situation analysis of financial industry 470
Second, reform direction of financial industry in 2008 479
Chapter Eight Present situation and development trend analysis of IC card market of our country 489
Section One Profile of Chinese FRID market in 2007 489
First, the government program was still the propelling force of RFID application 489
Second, the standard formulation of ultra-high frequency RFID makes the breakthrough 490
Third, new developing application market of NFC rises gradually 491
Fourth, RFID industry evaluation of the year in 2007 491
Section Two Competition pattern of Chinese IC card market 495
First, competition condition of Chinese IC card market in 2007 495
Second, competition pattern evolvement of domestic and foreign IC card manufacturer 502
Third, profound change of IC card market pattern of our country 504
Section Three Development and tendency forecast of Chinese IC card market in 2008 508
First, the application domain of IC card consummates unceasingly 508
Second, manufacturer condition of Chinese IC card market 510
Third, potential of Chinese IC card market is huge 511
Fourth, development tendency of Chinese IC card market in 2008 512
CHART CONTENTS
Chart: Performance comparison of several kinds of card 5
Chart: Application and classification of IC card 8
Chart: Utilization of smart card in construction aspect 34
Chart: Application scope of company card 34
Chart: Application that smart card use in company’s resources utilization 36
Chart: Application of smart card in cafeteria management 36
Chart: IC card meter’s management pattern 40
Chart: IC card meter’s work schematic diagram 45
Chart: Introduction of selling electricity management system of Beijing Power supply bureau 49
Chart: User card’s file structure 52
Chart: ESAM module’s file structure 52
Chart: The flow map that management system sends the card 53
Chart: Development process of RFID technology 62
Chart: Members of RFID standard working group 71
Chart: EMV’s migration process table 99
Chart: Global payment card market in 2005 134
Chart: Distribution structure of world smart card market in 2007 160
Chart: China top 10 IC design companies of 2006 189
Chart: China top 10 IC and discrete devices manufacturing companies of 2006 189
Chart: China top 10 integrated circuit packaging and testing companies of 2006 190
Chart: Digital ASIC researches and develops the main products for China IC design company 195
Chart: The design type of Chinese IC design companies develop 195
Chart: Overview of China IC design company's design level of 2006 195
Chart: consumption electronics is mainstream applications of China's IC products 196
Chart: Overview of some multimedia IC of native country 196
Chart: Design object which China IC Company start in 2006 197
Chart: The proportion of Chinese design engineer's number to the total number of person of enterprise staff in 2007 197
Chart: The proportion of Chinese design engineer who engaged in relevant work of design and development in 2007 198
Chart: The proportion of electronic product category that Chinese electronic design engineer designed in 2007 198
Chart: Electronic design engineer's proportion in the electronic manufacturing company of different business properties in China of 2007 199
Chart: The distribution of Chinese electronic design engineers in the country of 2007 199
Chart: An average work experience of Chinese electronic design engineers in 2007 200
Chart: The proportion of the items number that Chinese engineers involved in the design in 2007 200
Chart: The proportion that Chinese electronic design engineers involved in the design of the new projects in 2007 201
Chart: The proportion of Chinese electronic design engineers in the improved project base on the existing design in 2007 201
Chart: The proportion of design project that Chinese electronic design engineers based on the outside system design cases in 2007 202
Chart: The situation that Chinese electronic design engineers face the challenge in 2007 202
Chart: Aspects that Chinese electronic design engineers focused on the design of those projects of 2007 203
Chart: The proportion of the number of people that Chinese electronic design engineer base on the original basis to improve in 2007 203
Chart: The average time that Chinese electronic design engineers complete a project spent in 2007 204
Chart: China's standards that Chinese electronic design engineers concern in the future two years in 2007 204
Chart: The proportion that China's electronic design engineers have design capacity in 2007 205
Chart: Chinese electronic design engineer plan to apply the following technology to the design object in the next two years in 2007 205
Chart: The proportion that Chinese electronic design engineers face the challenge of ordinary design in 2007 206
Chart: The proportion of the source of the resources that Chinese electronic design engineers design the project used in 2007 206
Chart: The proportion of attitude that Chinese electronic design engineer refer to the tools of the design solution in 2007 207
Chart: The situation that Chinese electronic design engineer participate in the choosing course of components and parts of the inaugural company in 2007 207
Chart: The channel situation that Chinese electronic design engineer understand the latest technology in 2007 208
Chart: Channel that the electronic design engineer in China depends on while choosing the components and parts of 2007 208
Chart: The occupancy situation of foreign brand of IC that Chinese electronic design engineer uses in 2007 209
Chart: The situation of foreign brand of the discrete components and parts that Chinese electronic design engineer uses in 2007 209
Chart: The production source situation of ASIC which the electronic design engineer in China uses in 2007 210
Chart: The packaging form of main domestic owned enterprises 249
Chart: The packaging form of main domestic joint ventures 250
Chart: The packaging form of main domestic packaging enterprises 250
Chart: The proportions that professional factory of processing take the place of total packaging market in 2005-2007 258
Chart: Gross profit rate of 6 big packaging and testing enterprise in the whole world in 2006 259
Chart: Gross profit rate of 6 big packaging and testing enterprise in the whole world in he first quarter of 2006 259
Chart: 10 big packaging Company's ranks in the world of 2006 259
Chart: Growth trend of global semiconductor market in 2007 262
Chart: Market scale and trend global semiconductor packaging and testing in 2007-2009 262
Chart: Products proportion of Taiwan packaging industry in 2007 265
Chart: Trend of output value of Taiwan IC packaging industry of 2005-2009 265
Chart: Taiwan testing industry's products proportion in 2007 266
Chart: The trend of output value of Taiwan IC testing industry in 2005-2009 266
Chart: Tendency picture of DRAM price of the first half of 2007 268
Chart: Business income of Infineon scientific and technological joint-stock company in the first quarter of 2008 277
Chart: Interest pretax profit of Infineon scientific and technological joint-stock company in the first quarter of 2008 277
Chart: Increase and decrease situation of per share of Infineon scientific and technological joint-stock company of 2007-2008 278
Chart: Financial situation of Infineon AIM department of 2007-2008 278
Chart: Financial situation of Infineon COM department of 2007-2008 279
Chart: Adjusted business income of Infineon other business segments / enterprise in 2007-2008 279
Chart: Adjusted pretax profit of Infineon other business segments / enterprise in 2007-2008 279
Chart: The amalgamated financial statement of Infineon scientific and technological joint-stock company in 2007-2008 280
Chart: The amalgamated financial statement of Infineon scientific and technological joint-stock company in 2007-2008 280
Chart: Net income and net expenses in amalgamated financial statement of Infineon scientific and technological joint-stock company in 2007-2008 281
Chart: Net sales amount of every business domain of Infineon scientific and technological joint-stock company of 2007-2008 281
Chart: Pretax profit of every business field of Infineon scientific and technological joint-stock company of 2007-2008 282
Chart: Every area of Infineon scientific and technological joint-stock company take the proportion of the sales amount in 2007 282
Chart: Simple table of aggregate balance sheet of Infineon scientific and technological joint-stock company in 2007(1) 283
Chart: Simple table of aggregate balance sheet of Infineon scientific and technological joint-stock company in 2007(2) 284
Chart: The simple form of cash flow statement of Infineon scientific and technological joint-stock company in 2007-2008 285
Chart: Gross cash position and net cash position of Infineon scientific and technological joint-stock company in 2007-2008 285
Chart: Free cash flow of Infineon scientific and technological joint-stock company in 2007-2008 286
Chart: Staff quantity of Infineon scientific and technological joint-stock company in 2007 286
Chart: Samsung’s investment plan of 2008 300
Chart: Renesas Company's overview 328
Chart: Business income situation of Zhuhai Actions in 2007 343
Chart: Institutional framework of Huada Electronic 348
Chart: Main business indicator of Hangzhou Silan microelectronics Limited Company in 2007 353
Chart: The newest unusual fluctuation of Hangzhou Silan microelectronics Limited Company in 2007 353
Chart: Brief financial index over the years of Shanghai Belling Limited Company 365
Chart: Shanghai Belling Limited Company's profit form and profit ability in 2004-2007 365
Chart: Shanghai Belling Limited Company’s management and development capacity in 2004-2007 366
Chart: Shanghai Belling Limited Company's assets and debt of 2004-2007 366
Chart: Shanghai Belling Limited Company's cash flow of 2004-2007 367
Chart: Shanghai Belling Limited Company's unusual fluctuation financial index in 2004-2007 367
Chart: Brief index of the financial affairs of HengBao Co., Ltd. over the years 409
Chart: Profit forms and profit ability of HengBao Co., Ltd. in 2004-2007 409
Chart: Management and development capacity of HengBao Co., Ltd. in 2004-2007 410
Chart: Assets and debt of HengBao Co., Ltd.in 2004-2007 410
Chart: Cash flow of HengBao Co., Ltd. in 2004-2007 411
Chart: China smart card market scale in 2003-2007 470
Chart: Market scale and growth of Chinese RFID in 2004-2007 490
Chart: Top ten successful application case which have most influence in Chinese RFID industry in 2007 492
Chart: Top ten products which have most influence in Chinese RFID industry in 2007 493
Chart: Top ten events which have most influence in Chinese RFID industry in 2007 493
Chart: Top ten enterprises which have most influence in Chinese RFID industry in 2007 494
Chart: Market structure of Chinese IC card in 2007 494
Chart: Manufacturer’s brand structure of Chinese IC card market in 2007 504
Chart: Increase of sales volume and export amount of IC that China mainland produce in 2003-2007 508
Chart: Output of IC that China mainland produce in 2003-2007 508
Chart: Scale and growth of sales revenue of Chinese IC card industry in 2004-2006 511
B001
Corporation Information